Equipment Performance Characteristics
1. Leading scribing process
We use 1064nm or 532nm light source whose optical path is fixed, the beam quality is good, the laser scribing width is thin and the heat affected zone is small. The cutting section of the cell is tidier, the damage to the cell is small, and the cutting is accurate.
2. High working efficiency
The laser scribing speed is fast, the automation degree of the whole machine is high, and the equipment productivity can reach 3400 full cells/hour.
3. High precision positioning
Visual positioning of CCD cell, taken by high-precision four-axis robotic arm, positioning accuracy ≤0.1mm
4. Higher automation,
Automatic transmission of material box, automatic charging and discharging of cell, automatic positioning, automatic scribing, automatic splitting, and automatic package of small wafers. It is stable in performance, low in failure rate and simple in maintenance.
设备简介
适用于单晶硅和多晶硅材料太阳电池1/2等分划片和裂片，能够完成自动给料、自动定位划片、自动裂片、小片自动装盒等功能。
设备特点
1、划片工艺：采用532nm绿光光源，光程固定，光束质量好，激光划线宽度细，热影响区小；电池片切割断面更整齐，对电池片损伤小，切割精准。
2、工作效率高：激光划片速度快，设备产能可达3400整片/小时。
3、CCD外观检测：高精度机器臂取片，定位精度≤0.1。
4、自动化程度高，料盒自动传输、电池片自动上下料、自动定位、自动划片、自动裂片、小片自动装盒。性能稳定，故障率低，维护简单。
It is suitable for 1/2 equal scribing and splitting of solar cells made of monocrystalline silicon and polycrystalline silicon materials, and can complete the functions of automatic feeding, automatic positioning scribing, automatic splitting, automatic packing of small wafers, etc.