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松下底填胶CV5300AK01EPS

  • 发布时间:2024-11-22 16:06:05
    报价:面议
    地址:上海,松江,松乐路128号
    公司:上海金泰诺材料科技有限公司
    手机:13817204081
    微信:holdlove360
    用户等级:普通会员已认证

    松下底填胶CV5300AK01EPS

    Liquid encapsulant materials

    CV5300AK

    TECHNICAL INFORMATION

    Encapsulation Materials Department Plastic Materials Business Unit Electronic Materials Business Division

    Panasonic Industory Co., Ltd

    This is one component epoxy for Flip-chip underfilling.

    TYPICAL  PROPERTIES

    Properties

    Unit

    Data

    Test Method

    Viscosity(25oC)

    Pa*s

    20

    KES-B-0102

    Gelation time

    sec

    800

    EKS-B-1051

    RECOMMENDING PREHEAT CONDITION

    temperature of substrate :  80~120oC

    temperature of syringe :  R.T.~ 60oC

    TYPICAL CURED PROPERTIES

    Measurement Cure Conditions :  100'C2hour + 150`C 2hour

    松下底填胶CV5300AK01EPS

    ・Stored compound must be thawed before use. Warm at room temperature until no longer cool to touch (about 2hrs).

    ・Please use up the material within 12 hrs.

    ・Compound must be stored in the cool condition with sealing.

    ・Please keep material under -40oC after receiving product.

    ATTENTION TO HANDLING

    ・Please avoid direct contact with this product by wearing gloves, protecting gears,etc.

    ・Prevent frequent skin contact. If contact occurs, wash immediately with soap and water.

    松下底填胶CV5300AK01EPS

    松下底填胶CV5300AK01EPS

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